In digital imaging applications, data are typically obtained via a spatial subsampling procedure implemented as a color filter array--a physical construction whereby only a single...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
Today a growing community of DIY-practitioners, artists and designers are using microcontroller-based toolkits to express their concepts for digital artifacts by building them. Ho...
Recently, cooperative communication has attracted a lot of attention for its potential to increase spatial diversity. However, limited attention has been paid to the physical laye...
The convergence of computers and the physical world is the theme for next generation networking research. This trend calls for real-time network infrastructure, which requires a h...
Qixin Wang, Sathish Gopalakrishnan, Xue Liu, Lui S...