3522 search results - page 194 / 705 » Incremental physical design |
155
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ICCAD
2009
IEEE
15 years 4 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
140
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DAC
2005
ACM
16 years 7 months ago
2005
ACM
Since across-chip interconnect delays can exceed a clock cycle in nanometer technologies, it has become essential in high performance designs to add flip-flops on wires with multi...
169
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GECCO
2005
Springer
16 years 2 days ago
2005
Springer
To help chemists design new drugs, we created a tool that uses interactive evolution to design drug molecules, the “Molecule Evoluator”. In contrast to most other evolutionary...
167
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AFRIGRAPH
2004
ACM
16 years 45 min ago
2004
ACM
This paper describes the process of designing an authoring tool for virtual environments, using constructivist principles. The focus of the tool is on helping novice designers wit...
138
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ISLPED
2004
ACM
15 years 12 months ago
2004
ACM
Voltage islands enable core-level power optimization for Systemon-Chip (SoC) designs by utilizing a unique supply voltage for each core. Architecting voltage islands involves isla...