—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
This work is motivated by the strong demand of reliability enhancement over flash memory. Our objective is to improve the endurance of flash memory with limited overhead and witho...
Recommender systems have been widely advocated as a way of coping with the problem of information overload for knowledge workers. Given this, multiple recommendation methods have ...
In this paper, we consider hybrid peer-to-peer systems where users form an unstructured peer-to-peer network with the purpose of assisting a server in the distribution of data. We...
We aim at merging technologies from information technology, roomware, and robotics in order to design adaptive and intelligent furniture. This paper presents design principles for ...