Social networks are popular platforms for interaction, communication and collaboration between friends. Researchers have recently proposed an emerging class of applications that l...
Christo Wilson, Bryce Boe, Alessandra Sala, Krishn...
As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
Shuguang Feng, Shantanu Gupta, Amin Ansari, Scott ...
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Mur...
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...