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» Improvement of ASIC Design Processes
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ASPDAC
2005
ACM
86views Hardware» more  ASPDAC 2005»
16 years 7 days ago
Thermal-driven multilevel routing for 3-D ICs
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
Jason Cong, Yan Zhang
ACISP
2005
Springer
16 years 7 days ago
Building Secure Tame-like Multivariate Public-Key Cryptosystems: The New TTS
Abstract. Multivariate public-key cryptosystems (sometimes polynomial-based PKC’s or just multivariates) handle polynomials of many variables over relatively small fields instea...
Bo-Yin Yang, Jiun-Ming Chen
PVM
2005
Springer
16 years 4 days ago
Cooperative Write-Behind Data Buffering for MPI I/O
Many large-scale production parallel programs often run for a very long time and require data checkpoint periodically to save the state of the computation for program restart and/o...
Wei-keng Liao, Kenin Coloma, Alok N. Choudhary, Le...
MOBIDE
2003
ACM
15 years 12 months ago
TiNA: a scheme for temporal coherency-aware in-network aggregation
This paper presents TiNA, a scheme for minimizing energy consumption in sensor networks by exploiting end-user tolerance to temporal coherency. TiNA utilizes temporal coherency to...
Mohamed A. Sharaf, Jonathan Beaver, Alexandros Lab...
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CASES
2009
ACM
15 years 11 months ago
Complete nanowire crossbar framework optimized for the multi-spacer patterning technique
Nanowire crossbar circuits are an emerging architectural paradigm that promises a higher integration density and an improved fault-tolerance due to its reconfigurability. In this...
M. Haykel Ben Jamaa, Gianfranco Cerofolini, Yusuf ...