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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
15 years 11 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
CF
2007
ACM
15 years 11 months ago
Accelerating memory decryption and authentication with frequent value prediction
This paper presents a novel architectural technique to hide fetch latency overhead of hardware encrypted and authenticated memory. A number of recent secure processor designs have...
Weidong Shi, Hsien-Hsin S. Lee
DAC
2010
ACM
15 years 11 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
ICDE
2007
IEEE
190views Database» more  ICDE 2007»
15 years 10 months ago
CPS-tree: A Compact Partitioned Suffix Tree for Disk-based Indexing on Large Genome Sequences
Suffix tree is an important data structure for indexing a long sequence (like a genome sequence) or a concatenation of sequences. It finds many applications in practice, especiall...
Swee-Seong Wong, Wing-Kin Sung, Limsoon Wong
AUSAI
2004
Springer
15 years 10 months ago
On Enhancing the Performance of Spam Mail Filtering System Using Semantic Enrichment
With the explosive growth of the Internet, e-mails are regarded as one of the most important methods to send e-mails as a substitute for traditional communications. As e-mail has b...
Hyun-Jun Kim, Heung-Nam Kim, Jason J. Jung, GeunSi...
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