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184
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SCSC
2007
15 years 8 months ago
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
— The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications. Here we attempt to addres...
Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li
SDM
2007
SIAM
169views Data Mining» more  SDM 2007»
15 years 8 months ago
Rank Aggregation for Similar Items
The problem of combining the ranked preferences of many experts is an old and surprisingly deep problem that has gained renewed importance in many machine learning, data mining, a...
D. Sculley
WCE
2008
15 years 8 months ago
IEEE 802.11E Block Acknowledgement Policies
Optimisation of IEEE 802.11e MAC protocol performance can be performed by modifying several parameters left open in the standard, like buffer size and acknowledgement policies. In ...
Orlando Cabral, Alberto Segarra, Fernando J. Velez
WICON
2008
15 years 8 months ago
Towards optimally exploiting physical layer information in OFDM wireless networks
Wireless communication is inherently vulnerable in nature and packets can be corrupted due to various reasons. The network performance can potentially be improved if one is able t...
Zheng Zeng, P. R. Kumar
206
Voted
WICSA
2008
15 years 8 months ago
Analyzing the Evolution of Large-Scale Software Systems Using Design Structure Matrices and Design Rule Theory: Two Exploratory
Software modularization activities remain without the guidance of formal theories and models. According to Baldwin and Clark's [1] design rule theory (DRT) , modular architec...
Matthew J. LaMantia, Yuanfang Cai, Alan MacCormack...
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