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CASES
2010
ACM
15 years 4 months ago
Hardware trust implications of 3-D integration
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
CVIU
2011
14 years 10 months ago
Polynomial algorithms for subisomorphism of nD open combinatorial maps
Combinatorial maps describe the subdivision of objects in cells, and incidence and adjacency relations between cells, and they are widely used to model 2D and 3D images. However, ...
Guillaume Damiand, Christine Solnon, Colin de la H...
ICCV
2011
IEEE
14 years 6 months ago
3D Reconstruction of a Smooth Articulated Trajectory from a Monocular Image Sequence
An articulated trajectory is defined as a trajectory that remains at a fixed distance with respect to a parent trajectory. In this paper, we present a method to reconstruct an a...
Hyun Soo Park, Yaser Sheikh
DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
CVPR
1999
IEEE
16 years 8 months ago
Eigen-Texture Method: Appearance Compression Based on 3D Model
Image-based and model-based methods are two representative rendering methods for generating virtual images of objects from their real images. Extensive research on these two metho...
Ko Nishino, Yoichi Sato, Katsushi Ikeuchi