3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
Combinatorial maps describe the subdivision of objects in cells, and incidence and adjacency relations between cells, and they are widely used to model 2D and 3D images. However, ...
Guillaume Damiand, Christine Solnon, Colin de la H...
An articulated trajectory is defined as a trajectory that remains at a fixed distance with respect to a parent trajectory. In this paper, we present a method to reconstruct an a...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Image-based and model-based methods are two representative rendering methods for generating virtual images of objects from their real images. Extensive research on these two metho...