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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
16 years 3 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
WACV
2005
IEEE
16 years 12 days ago
Automatic 2D Hand Tracking in Video Sequences
In gesture and sign language video sequences, hand motion tends to be rapid, and hands frequently appear in front of each other or in front of the face. Thus, hand location is oft...
Quan Yuan, Stan Sclaroff, Vassilis Athitsos
HM
2005
Springer
152views Optimization» more  HM 2005»
16 years 11 days ago
3D Inter-subject Medical Image Registration by Scatter Search
Image registration is a very active research area in computer vision, namely it is used to find a transformation between two images taken under different conditions. Point matchi...
Oscar Cordón, Sergio Damas, Jose Santamar&i...
DCOSS
2009
Springer
15 years 11 months ago
Local Construction of Spanners in the 3-D Space
Abstract. In this paper we present local distributed algorithms for constructing spanners in wireless sensor networks modeled as unit ball graphs (shortly UBGs) and quasi-unit ball...
Iyad A. Kanj, Ge Xia, Fenghui Zhang
VISUALIZATION
2000
IEEE
15 years 11 months ago
3D digital cleansing using segmentation rays
We propose a novel approach for segmentation and digital cleansing of endoscopic organs. Our method can be used for a variety of segmentation needs with little or no modification...
Sarang Lakare, Ming Wan, Mie Sato, Arie E. Kaufman