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DAC
2011
ACM
14 years 6 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
ICDCS
2011
IEEE
14 years 6 months ago
E-Shadow: Lubricating Social Interaction Using Mobile Phones
—In this paper, we propose E-Shadow, a distributed mobile phone-based local social networking system. E-Shadow has two main components: (1) Local profiles. They enable EShadow u...
Jin Teng, Boying Zhang, Xinfeng Li, Xiaole Bai, Do...
PPOPP
2012
ACM
14 years 2 months ago
A speculation-friendly binary search tree
We introduce the first binary search tree algorithm designed for speculative executions. Prior to this work, tree structures were mainly designed for their pessimistic (non-specu...
Tyler Crain, Vincent Gramoli, Michel Raynal
MOBIHOC
2012
ACM
13 years 9 months ago
Serendipity: enabling remote computing among intermittently connected mobile devices
Mobile devices are increasingly being relied on for services that go beyond simple connectivity and require more complex processing. Fortunately, a mobile device encounters, possi...
Cong Shi, Vasileios Lakafosis, Mostafa H. Ammar, E...
CF
2009
ACM
16 years 1 months ago
Wave field synthesis for 3D audio: architectural prospectives
In this paper, we compare the architectural perspectives of the Wave Field Synthesis (WFS) 3D-audio algorithm mapped on three different platforms: a General Purpose Processor (GP...
Dimitris Theodoropoulos, Catalin Bogdan Ciobanu, G...
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