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166
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ICCAD
2010
IEEE
15 years 4 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
164
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DEBU
2010
15 years 4 months ago
2010
Over the past decade, new solid state storage technologies, with flash being the most mature one, have become increasingly popular. Such technologies store data durably, and can a...
266
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ICST
2011
IEEE
14 years 10 months ago
2011
IEEE
—The length of test cases is a little investigated topic in search-based test generation for object oriented software, where test cases are sequences of method calls. While intui...
200
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MMM
2011
Springer
14 years 9 months ago
2011
Springer
Various interfaces for video browsing and retrieval have been proposed that provide improved usability, better retrieval performance, and richer user experience compared to simple ...
159
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CIKM
2011
Springer
14 years 6 months ago
2011
Springer
This paper describes how to make use of e-books that look like printed books in a knowledge network. After an overview of digitalization efforts and current digital library initia...