The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
With increasing chip densities, future microprocessor designs have the opportunity to integrate many of the traditional systemlevel modules onto the same chip as the processor. So...
— In this paper, we study how to appropriately match users for two-user cooperative diversity systems that deploy optimal power allocation for an amplify and forward or a regener...
Veluppillai Mahinthan, Lin Cai, Jon W. Mark, Xuemi...
Despite the well-known performances and the theoretical power of neural networks, learning and generalizing are sometimes very difficult. In this article, we investigate how short ...
In this paper we consider how to efficiently identify tags on the moving conveyor. Considering conditions like the path loss and multi-path effect in realistic settings, we first p...
Lei Xie, Bo Sheng, Chiu Chiang Tan, Hao Han, Qun L...