6660 search results - page 984 / 1332 » Highly-Available Application Integration |
161
Voted
ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
171
Voted
ICCAD
2004
IEEE
16 years 3 months ago
2004
IEEE
Traditional timing-driven placement considers only combinational delays and does not take into account the potential of subsequent sequential optimization steps. As a result, the ...
197
click to vote
ICCAD
2001
IEEE
16 years 3 months ago
2001
IEEE
This paper presents a new methodology for system-level power and performance analysis of wireless multimedia systems. More precisely, we introduce an analytical approach based on ...
184
click to vote
SOSP
2009
ACM
16 years 3 months ago
2009
ACM
Fabric is a new system and language for building secure distributed information systems. It is a decentralized system that allows heterogeneous network nodes to securely share bot...
213
click to vote
SOSP
2009
ACM
16 years 3 months ago
2009
ACM
Data-intensive applications are increasingly designed to execute on large computing clusters. Grouped aggregation is a core primitive of many distributed programming models, and i...