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DAC
2010
ACM
15 years 10 months ago
TSV stress aware timing analysis with applications to 3D-IC layout optimization
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee,...
JUCS
2008
118views more  JUCS 2008»
15 years 6 months ago
Enhancements of Meeting Information Management and Application for Knowledge Access and Learning Activities
: Communication processes have become increasingly important in modern working life. Organizations invest a surprisingly high amount of financial resources and employee work time i...
Christian Gütl
TIP
2008
169views more  TIP 2008»
15 years 6 months ago
Maximum Likelihood Wavelet Density Estimation With Applications to Image and Shape Matching
Density estimation for observational data plays an integral role in a broad spectrum of applications, e.g. statistical data analysis and information-theoretic image registration. ...
Adrian M. Peter, Anand Rangarajan
ICSE
2000
IEEE-ACM
15 years 10 months ago
Galileo: a tool built from mass-market applications
We present Galileo, an innovative engineering modeling and analysis tool built using an approach we call packageoriented programming (POP). Galileo represents an ongoing evaluatio...
David Coppit, Kevin J. Sullivan
BMCBI
2004
161views more  BMCBI 2004»
15 years 6 months ago
Three-parameter lognormal distribution ubiquitously found in cDNA microarray data and its application to parametric data treatme
Background: To cancel experimental variations, microarray data must be normalized prior to analysis. Where an appropriate model for statistical data distribution is available, a p...
Tomokazu Konishi