Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
—Large ISPs have been growing rapidly in both the size and global connectivity. To scale with the sheer number of routers, many providers have replaced the flat full-mesh iBGP c...
Jong Han Park, Pei-chun Cheng, Shane Amante, Doria...
Publish/subscribe systems utilize filter algorithms to determine all subscriptions matching incoming event messages. To distribute such services, subscriptions are forwarded to s...
— While BGP routing datasets, consisting of raw routing data, are freely available and easy to obtain, extracting any useful information is tedious. Currently, researcher and net...