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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
15 years 4 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
DAC
2011
ACM
14 years 6 months ago
DRAIN: distributed recovery architecture for inaccessible nodes in multi-core chips
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
INFOCOM
2012
IEEE
13 years 8 months ago
A comparative study of architectural impact on BGP next-hop diversity
—Large ISPs have been growing rapidly in both the size and global connectivity. To scale with the sheer number of routers, many providers have replaced the flat full-mesh iBGP c...
Jong Han Park, Pei-chun Cheng, Shane Amante, Doria...
ACSC
2006
IEEE
16 years 15 days ago
Pruning subscriptions in distributed publish/subscribe systems
Publish/subscribe systems utilize filter algorithms to determine all subscriptions matching incoming event messages. To distribute such services, subscriptions are forwarded to s...
Sven Bittner, Annika Hinze
NOMS
2006
IEEE
146views Communications» more  NOMS 2006»
16 years 13 days ago
BGP-Inspect - Extracting Information from Raw BGP Data
— While BGP routing datasets, consisting of raw routing data, are freely available and easy to obtain, extracting any useful information is tedious. Currently, researcher and net...
Dionysus Blazakis, Manish Karir, John S. Baras