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TPDS
1998
129views more  TPDS 1998»
15 years 6 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
W. Stephen Lacy, José Cruz-Rivera, D. Scott...
TMC
2010
150views more  TMC 2010»
15 years 5 months ago
Handling Mobility in Wireless Sensor and Actor Networks
— In Wireless Sensor and Actor Networks (WSANs), the collaborative operation of sensors enables the distributed sensing of a physical phenomenon, while actors collect and process...
Tommaso Melodia, Dario Pompili, Ian F. Akyildiz
ICES
2010
Springer
277views Hardware» more  ICES 2010»
15 years 4 months ago
An Efficient, High-Throughput Adaptive NoC Router for Large Scale Spiking Neural Network Hardware Implementations
Recently, a reconfigurable and biologically inspired paradigm based on network-on-chip (NoC) and spiking neural networks (SNNs) has been proposed as a new method of realising an ef...
Snaider Carrillo, Jim Harkin, Liam McDaid, Sandeep...
INFOCOM
2010
IEEE
15 years 4 months ago
On Space-Time Capacity Limits in Mobile and Delay Tolerant Networks
We investigate the fundamental capacity limits of space-time journeys of information in mobile and Delay Tolerant Networks (DTNs), where information is either transmitted or carrie...
Philippe Jacquet, Bernard Mans, Georgios Rodolakis
MICRO
2010
IEEE
153views Hardware» more  MICRO 2010»
15 years 4 months ago
Throughput-Effective On-Chip Networks for Manycore Accelerators
As the number of cores and threads in manycore compute accelerators such as Graphics Processing Units (GPU) increases, so does the importance of on-chip interconnection network des...
Ali Bakhoda, John Kim, Tor M. Aamodt