6008 search results - page 1059 / 1202 » Heterogeneity in |
184
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WISE
2009
Springer
16 years 3 months ago
2009
Springer
ct One significant effort towards combining the virtues of Web search, viz. being accessible to untrained users and able to cope with vastly heterogeneous data, with those of dat...
169
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HIPEAC
2010
Springer
16 years 3 months ago
2010
Springer
As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
200
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ICCD
2002
IEEE
16 years 3 months ago
2002
IEEE
The requirements to system and software development tools brought up by the automotive industry differ from the requirements that other customers have. The important catchwords he...
204
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
The ability to integrate diverse components such as processor cores, memories, custom hardware blocks and complex network-on-chip (NoC) communication frameworks onto a single chip...
155
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ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...