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ICCAD
2005
IEEE
117views Hardware» more  ICCAD 2005»
16 years 3 months ago
IMF: interconnect-driven multilevel floorplanning for large-scale building-module designs
Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
Tung-Chieh Chen, Yao-Wen Chang, Shyh-Chang Lin
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
SOSP
2005
ACM
16 years 3 months ago
Capturing, indexing, clustering, and retrieving system history
We present a method for automatically extracting from a running system an indexable signature that distills the essential characteristic from a system state and that can be subjec...
Ira Cohen, Steve Zhang, Moisés Goldszmidt, ...
SOSP
2005
ACM
16 years 3 months ago
IRON file systems
Commodity file systems trust disks to either work or fail completely, yet modern disks exhibit more complex failure modes. We suggest a new fail-partial failure model for disks, ...
Vijayan Prabhakaran, Lakshmi N. Bairavasundaram, N...
CVPR
2010
IEEE
16 years 2 months ago
Toward Coherent Object Detection And Scene Layout Understanding
Detecting objects in complex scenes while recovering the scene layout is a critical functionality in many vision-based applications. Inspired by the work of [18], we advocate the ...
Yingze Bao, Min Sun, Silvio Savarese
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