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DAC
2012
ACM
13 years 9 months ago
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Xin Zhao, Michael Scheuermann, Sung Kyu Lim
DM
2008
100views more  DM 2008»
15 years 6 months ago
Staircase tilings and k-Catalan structures
Many interesting combinatorial objects are enumerated by the k-Catalan numbers, one possible generalization of the Catalan numbers. We will present a new combinatorial object that...
Silvia Heubach, Nelson Y. Li, Toufik Mansour
184
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HPCA
2004
IEEE
16 years 7 months ago
Out-of-Order Commit Processors
Modern out-of-order processors tolerate long latency memory operations by supporting a large number of inflight instructions. This is particularly useful in numerical applications...
Adrián Cristal, Daniel Ortega, Josep Llosa,...
SOSP
2003
ACM
16 years 3 months ago
Decentralized user authentication in a global file system
The challenge for user authentication in a global file system is allowing people to grant access to specific users and groups in remote administrative domains, without assuming ...
Michael Kaminsky, George Savvides, David Mazi&egra...
MICRO
2009
IEEE
168views Hardware» more  MICRO 2009»
16 years 1 months ago
Ordering decoupled metadata accesses in multiprocessors
Hardware support for dynamic analysis can minimize the performance overhead of useful applications such as security checks, debugging, and profiling. To eliminate implementation ...
Hari Kannan