As device size shrinks to the nanometer range, FPGAs are increasingly prone to manufacturing defects. We anticipate that the ability to tolerate multiple defects will be very impo...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
As energy-related costs have become a major economical factor for IT infrastructures and data-centers, companies and the research community are being challenged to find better an...
Fires or toxic gas leakages may have grave consequences like significant pecuniary loss or even lead to human victims. In this paper we present an autonomous wireless sensor syste...
Andrey Somov, D. Spirjakin, M. Ivanov, I. Khromush...
HCI, CSCW, and ubicomp researchers have developed new technologies and interaction techniques to support collaboration, ranging from electronic whiteboards to software supporting ...