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DAC
2011
ACM
14 years 6 months ago
Non-uniform micro-channel design for stacked 3D-ICs
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
Bing Shi, Ankur Srivastava, Peng Wang
DAC
2011
ACM
14 years 6 months ago
Process-level virtualization for runtime adaptation of embedded software
Modern processor architectures call for software that is highly tuned to an unpredictable operating environment. Processlevel virtualization systems allow existing software to ada...
Kim M. Hazelwood
DAC
2011
ACM
14 years 6 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
DAC
2011
ACM
14 years 6 months ago
ChronOS Linux: a best-effort real-time multiprocessor Linux kernel
We present ChronOS Linux, a best-effort real-time Linux kernel for chip multiprocessors (CMPs). ChronOS addresses the intersection of three problem spaces: a) OS-support for obta...
Matthew Dellinger, Piyush Garyali, Binoy Ravindran
DAC
2011
ACM
14 years 6 months ago
Plugging versus logging: a new approach to write buffer management for solid-state disks
Using device write buffers is a promising technique to improve the write performance of solid-state disks. The write buffer not only reduces the write traffic to the flash but als...
Li-Pin Chang, You-Chiuan Su