The dependence of the propagation delay of the interlayer 3-D interconnects on the vertical through via location and length is investigated. For a variable vertical through via lo...
This paper addresses the problem of low-power fanout optimization with multiple threshold voltage inverters. Introducing splitting and merging conversions that preserve delay, pow...
This paper presented a hierarchical power management architecture which aims to facilitate power-awareness in an Energy-Managed Computer (EMC) system with multiple components. The...
Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout....
In this invited note we describe Capo, an open-source software tool for cell placement, mixed-size placement and floorplanning with emphasis on routability. Capo is among the fas...
Jarrod A. Roy, David A. Papa, Saurabh N. Adya, Hay...