2452 search results - page 269 / 491 » Future Technological Challenges for High Performance Compute... |
181
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ICDCS
2011
IEEE
14 years 6 months ago
2011
IEEE
—Massively parallel scientific applications, running on extreme-scale supercomputers, produce hundreds of terabytes of data per run, driving the need for storage solutions to im...
164
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MICRO
2006
IEEE
16 years 20 days ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
173
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PERCOM
2007
ACM
16 years 6 months ago
2007
ACM
Due to the inherent nature of their heterogeneity, resource scarcity and dynamism, the provision of middleware for future networked embedded environments is a challenging task. In...
187
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WWW
2008
ACM
16 years 7 months ago
2008
ACM
Motivated by several marketplace applications on rapidly growing online social networks, we study the problem of efficient offline matching algorithms for online exchange markets....
168
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MM
2006
ACM
16 years 19 days ago
2006
ACM
There is a renewed interest in the 3DTV research primarily due to the advances in low cost 3D display technologies. The two views required for 3DTV can be compressed using standar...