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DATE
2009
IEEE
154views Hardware» more  DATE 2009»
16 years 1 months ago
Reliability aware through silicon via planning for 3D stacked ICs
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
ICPR
2002
IEEE
15 years 11 months ago
3D Reconstruction of Indoor and Outdoor Scenes Using a Mobile Range Scanner
This paper describes 3D mapping of indoor and outdoor environment using a mobile range scanner. In the raw range data preprocessing stage, we propose to use area decreasing flow ...
Yiyong Sun, Joon Ki Paik, Andreas Koschan, Mongi A...
ECCV
2008
Springer
16 years 8 months ago
3D Face Recognition by Local Shape Difference Boosting
Abstract. A new approach, called Collective Shape Difference Classifier (CSDC), is proposed to improve the accuracy and computational efficiency of 3D face recognition. The CSDC le...
Yueming Wang, Xiaoou Tang, Jianzhuang Liu, Gang Pa...
BIBE
2004
IEEE
149views Bioinformatics» more  BIBE 2004»
15 years 10 months ago
Interactive 3D Protein Structure Visualization Using Virtual Reality
Large-scale biomedical data sets of macromolecular structures such as DNA and proteins describe highly complex biomolecular entities which often consist of thousands of atoms and ...
Elke Moritz, Jörg Meyer
116
Voted
ICCV
2007
IEEE
16 years 8 months ago
Towards Wiki-based Dense City Modeling
This work reports on the advances and on the current status of a terrestrial city modeling approach, which uses images contributed by end-users as input. Hence, the Wiki principle...
Arnold Irschara, Christopher Zach, Horst Bischof