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170
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ICCD
2005
IEEE
16 years 3 months ago
2005
IEEE
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
181
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ICCD
2004
IEEE
16 years 3 months ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
148
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ICCD
2000
IEEE
16 years 3 months ago
2000
IEEE
In superscalar architectures, out-of-order issue mechanisms increase performance by dynamically rescheduling instructions that cannot be statically reordered by the compiler. Whil...
139
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
This paper examines how circuits and systems made from molecular QCA devices might function. Our design constraints are “chemically reasonable” in that we consider the charact...
150
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
—Existing ASIPs (application-specific instruction-set processors) and compiler-based co-processor synthesis approaches meet the increasing performance requirements of embedded ap...