1527 search results - page 134 / 306 » From Requirements to Design: Formalizing the Key Steps |
125
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
210
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EDOC
2009
IEEE
15 years 10 months ago
2009
IEEE
A key challenge in devising solutions to a range of problems associated with business process management: process life cycle management, compliance management, enterprise process ...
176
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IS
2008
15 years 6 months ago
2008
In this paper, we formalize the digital library (DL) integration problem and propose an overall approach based on the 5S (streams, structures, spaces, scenarios, and societies) fr...
180
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ECAI
2008
Springer
15 years 8 months ago
2008
Springer
Abstract. This paper shows that we can take advantage of information about the probabilities of the occurrences of events, when this information is available, to refine the classic...
177
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CORR
2011
Springer
15 years 1 months ago
2011
Springer
d Abstract) Sara Ahmadian∗ Chaitanya Swamy∗ We consider the lower-bounded facility location (LBFL) problem (also sometimes called load-balanced facility location), which is a ...