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171
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ICIP
2007
IEEE
16 years 1 months ago
Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed a...
Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Ts...
CODES
2006
IEEE
16 years 28 days ago
Thermal-aware high-level synthesis based on network flow method
Lowering down the chip temperature is becoming one of the important design considerations, since temperature adversely and seriously affects many of design qualities, such as reli...
Pilok Lim, Taewhan Kim
RSP
1999
IEEE
128views Control Systems» more  RSP 1999»
15 years 11 months ago
3-D Floorplanning: Simulated Annealing and Greedy Placement Methods for Reconfigurable Computing Systems
The advances in the programmable hardware has lead to new architectures where the hardware can be dynamically adapted to the application to gain better performance. There are stil...
Kia Bazargan, Ryan Kastner, Majid Sarrafzadeh
182
Voted
ITC
1995
IEEE
122views Hardware» more  ITC 1995»
15 years 10 months ago
A Fault Model and a Test Method for Analog Fuzzy Logic Circuits
A nalog circuit implementations of fuzzy logic are characterized by performing logical connectives of analog signals. They can be considered as generalization of digital circuits ...
Stefan Weiner
154
Voted
IJRR
2008
98views more  IJRR 2008»
15 years 6 months ago
Automatic Configuration Recognition Methods in Modular Robots
Recognizing useful modular robot configurations composed of hundreds of modules is a significant challenge. Matching a new modular robot configuration to a library of known configu...
Michael Park, Sachin Chitta, Alex Teichman, Mark Y...