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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICCAD
2004
IEEE
191views Hardware» more  ICCAD 2004»
16 years 4 months ago
Checking consistency of C and Verilog using predicate abstraction and induction
edicate Abstraction and Induction Edmund Clarke Daniel Kroening June 25, 2004 CMU-CS-04-131 School of Computer Science Carnegie Mellon University Pittsburgh, PA 15213 It is common...
Daniel Kroening, Edmund M. Clarke
CGO
2010
IEEE
16 years 2 months ago
Integrated instruction selection and register allocation for compact code generation exploiting freeform mixing of 16- and 32-bi
For memory constrained embedded systems code size is at least as important as performance. One way of increasing code density is to exploit compact instruction formats, e.g. ARM T...
Tobias J. K. Edler von Koch, Igor Böhm, Bj&ou...
ISPASS
2009
IEEE
16 years 2 months ago
Machine learning based online performance prediction for runtime parallelization and task scheduling
—With the emerging many-core paradigm, parallel programming must extend beyond its traditional realm of scientific applications. Converting existing sequential applications as w...
Jiangtian Li, Xiaosong Ma, Karan Singh, Martin Sch...
SIGSOFT
2009
ACM
16 years 2 months ago
MSeqGen: object-oriented unit-test generation via mining source code
An objective of unit testing is to achieve high structural coverage of the code under test. Achieving high structural coverage of object-oriented code requires desirable method-ca...
Suresh Thummalapenta, Tao Xie, Nikolai Tillmann, J...
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