Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
edicate Abstraction and Induction Edmund Clarke Daniel Kroening June 25, 2004 CMU-CS-04-131 School of Computer Science Carnegie Mellon University Pittsburgh, PA 15213 It is common...
For memory constrained embedded systems code size is at least as important as performance. One way of increasing code density is to exploit compact instruction formats, e.g. ARM T...
—With the emerging many-core paradigm, parallel programming must extend beyond its traditional realm of scientific applications. Converting existing sequential applications as w...
Jiangtian Li, Xiaosong Ma, Karan Singh, Martin Sch...
An objective of unit testing is to achieve high structural coverage of the code under test. Achieving high structural coverage of object-oriented code requires desirable method-ca...
Suresh Thummalapenta, Tao Xie, Nikolai Tillmann, J...