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TCAD
2008
114views more  TCAD 2008»
15 years 6 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
TCAD
2008
115views more  TCAD 2008»
15 years 6 months ago
Variability-Aware Design of Multilevel Logic Decoders for Nanoscale Crossbar Memories
Abstract--The fabrication of crossbar memories with sublithographic features is expected to be feasible within several emerging technologies; in all of them, the nanowire (NW) deco...
M. Haykel Ben Jamaa, Kirsten E. Moselund, David At...
TCBB
2008
107views more  TCBB 2008»
15 years 6 months ago
Coclustering of Human Cancer Microarrays Using Minimum Sum-Squared Residue Coclustering
It is a consensus in microarray analysis that identifying potential local patterns, characterized by coherent groups of genes and conditions, may shed light on the discovery of pre...
Hyuk Cho, Inderjit S. Dhillon
TCOM
2008
128views more  TCOM 2008»
15 years 6 months ago
Cross-Layer Rate and Power Adaptation Strategies for IR-HARQ Systems over Fading Channels with Memory: A SMDP-Based Approach
Abstract--Incremental-redundancy hybrid automatic repeatrequest (IR-HARQ) schemes are proposed in several wireless standards for increased throughput-efficiency and greater reliabi...
Ashok K. Karmokar, Dejan V. Djonin, Vijay K. Bharg...
ASE
2005
137views more  ASE 2005»
15 years 6 months ago
Rewriting-Based Techniques for Runtime Verification
Techniques for efficiently evaluating future time Linear Temporal Logic (abbreviated LTL) formulae on finite execution traces are presented. While the standard models of LTL are i...
Grigore Rosu, Klaus Havelund
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