Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Abstract--The fabrication of crossbar memories with sublithographic features is expected to be feasible within several emerging technologies; in all of them, the nanowire (NW) deco...
M. Haykel Ben Jamaa, Kirsten E. Moselund, David At...
It is a consensus in microarray analysis that identifying potential local patterns, characterized by coherent groups of genes and conditions, may shed light on the discovery of pre...
Abstract--Incremental-redundancy hybrid automatic repeatrequest (IR-HARQ) schemes are proposed in several wireless standards for increased throughput-efficiency and greater reliabi...
Ashok K. Karmokar, Dejan V. Djonin, Vijay K. Bharg...
Techniques for efficiently evaluating future time Linear Temporal Logic (abbreviated LTL) formulae on finite execution traces are presented. While the standard models of LTL are i...