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TCAD
2008
119views more  TCAD 2008»
15 years 6 months ago
Full-Chip Routing Considering Double-Via Insertion
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
Huang-Yu Chen, Mei-Fang Chiang, Yao-Wen Chang, Lum...
TCOM
2008
105views more  TCOM 2008»
15 years 6 months ago
High-rate diversity across time and frequency using linear dispersion
To improve performance of orthogonal frequency division multiplexing (OFDM) for fading channels, this paper proposes increasing frequency and time diversity using linear dispersion...
Jinsong Wu, Steven D. Blostein
TCS
2008
15 years 6 months ago
Bincoloring
We introduce a new problem that was motivated by a (more complicated) problem arising in a robotized assembly environment. The bin coloring problem is to pack unit size colored it...
Sven Oliver Krumke, Willem de Paepe, Jörg Ram...
TCSV
2008
143views more  TCSV 2008»
15 years 6 months ago
High-Speed Action Recognition and Localization in Compressed Domain Videos
We present a compressed domain scheme that is able to recognize and localize actions in real-time1 . The recognition problem is posed as performing an action video query on a test ...
Chuohao Yeo, Parvez Ahammad, Kannan Ramchandran, S...
TEC
2008
100views more  TEC 2008»
15 years 6 months ago
Real-Valued Compact Genetic Algorithms for Embedded Microcontroller Optimization
Recent research on compact genetic algorithms (cGAs) has proposed a number of evolutionary search methods with reduced memory requirements. In cGAs, the evolution of populations is...
Ernesto Mininno, Francesco Cupertino, David Naso
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