1379 search results - page 204 / 276 » Elements of low power design for integrated systems |
158
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MICRO
2006
IEEE
16 years 8 days ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
194
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WOWMOM
2009
ACM
16 years 23 days ago
2009
ACM
Abstract— Spectrum-agile radios, also known as cognitive radios, have a great potential to improve spectrum utilization by enabling dynamic access to the spectrum. A key challeng...
146
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DAC
2002
ACM
16 years 7 months ago
2002
ACM
Profiling an application executing on a microprocessor is part of the solution to numerous software and hardware optimization and design automation problems. Most current profilin...
156
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ISQED
2005
IEEE
15 years 12 months ago
2005
IEEE
Today's System-on-a-Chip (SoC) design methodology provides an efficient way to develop highly integrated systems on a single chip by utilizing pre-designed intellectual prope...
258
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SIGMOD
2006
ACM
16 years 6 months ago
2006
ACM
Recent data stream systems such as TelegraphCQ have employed the well-known property of duality between data and queries. In these systems, query processing methods are classified...