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ICCAD
2008
IEEE
109views Hardware» more  ICCAD 2008»
16 years 3 months ago
Verifying external interrupts of embedded microprocessor in SoC with on-chip bus
—The microprocessor verification challenge becomes higher in the on-chip bus (OCB) than in the unit-level. Especially for the external interrupts, since they interface with othe...
Fu-Ching Yang, Jing-Kun Zhong, Ing-Jer Huang
ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
16 years 3 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
ICCAD
2006
IEEE
146views Hardware» more  ICCAD 2006»
16 years 3 months ago
An analytical model for negative bias temperature instability
— Negative Bias Temperature Instability (NBTI) in PMOS transistors has become a significant reliability concern in present day digital circuit design. With continued scaling, th...
Sanjay V. Kumar, Chris H. Kim, Sachin S. Sapatneka...
ICCAD
2005
IEEE
97views Hardware» more  ICCAD 2005»
16 years 3 months ago
DiCER: distributed and cost-effective redundancy for variation tolerance
— Increasingly prominent variational effects impose imminent threat to the progress of VLSI technology. This work explores redundancy, which is a well-known fault tolerance techn...
Di Wu, Ganesh Venkataraman, Jiang Hu, Quiyang Li, ...
ICCAD
2002
IEEE
73views Hardware» more  ICCAD 2002»
16 years 3 months ago
Shaping interconnect for uniform current density
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...