—The microprocessor verification challenge becomes higher in the on-chip bus (OCB) than in the unit-level. Especially for the external interrupts, since they interface with othe...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
— Negative Bias Temperature Instability (NBTI) in PMOS transistors has become a significant reliability concern in present day digital circuit design. With continued scaling, th...
Sanjay V. Kumar, Chris H. Kim, Sachin S. Sapatneka...
— Increasingly prominent variational effects impose imminent threat to the progress of VLSI technology. This work explores redundancy, which is a well-known fault tolerance techn...
Di Wu, Ganesh Venkataraman, Jiang Hu, Quiyang Li, ...
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...