Abstract— Design variability due to within-die and die-todie process variations has the potential to significantly reduce the maximum operating frequency and the effective yield...
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
Abstract—Recent years have seen a trend in using graphic processing units (GPU) as accelerators for general-purpose computing. The inexpensive, single-chip, massively parallel ar...
In this paper we consider parity games defined by higher-order pushdown automata. These automata generalise pushdown automata by the use of higher-order stacks, which are nested ...
Arnaud Carayol, Matthew Hague, Antoine Meyer, C.-H...
be regarded as an abstraction of the underlying effective network connectivity, i.e. its functional connectivity. Although similar functional connectivity models have been describe...