—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
This paper investigates the performance implications of data placement in OpenMP programs running on modern ccNUMA multiprocessors. Data locality and minimization of the rate of r...
Dimitrios S. Nikolopoulos, Theodore S. Papatheodor...
This paper introduces a geometrically inspired large-margin classifier that can be a better alternative to the Support Vector Machines (SVMs) for the classification problems with ...
Conventional firewalls rely on topology restrictions and controlled network entry points to enforce traffic filtering. Furthermore, a firewall cannot filter traffic it does ...
Sotiris Ioannidis, Angelos D. Keromytis, Steven M....
Abstract--Leakage power consumption contributes significantly to the overall power dissipation for systems that are manufactured in advanced deep sub-micron technology. Different f...