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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
16 years 1 months ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
ICASSP
2009
IEEE
16 years 1 months ago
Genre effects on automatic sentence segmentation of speech: A comparison of broadcast news and broadcast conversations
We investigate genre effects on the task of automatic sentence segmentation, focusing on two important domains – broadcast news (BN) and broadcast conversation (BC). We employ a...
Jáchym Kolár, Yang Liu, Elizabeth Sh...
IEEEPACT
2009
IEEE
16 years 1 months ago
Analytical Modeling of Pipeline Parallelism
Parallel programming is a requirement in the multi-core era. One of the most promising techniques to make parallel programming available for the general users is the use of parall...
Angeles G. Navarro, Rafael Asenjo, Siham Tabik, Ca...
INFOCOM
2009
IEEE
16 years 1 months ago
CPM: Adaptive Video-on-Demand with Cooperative Peer Assists and Multicast
—We present CPM, a unified approach that exploits server multicast, assisted by peer downloads, to provide efficient video-on-demand (VoD) in a service provider environment. We...
Vijay Gopalakrishnan, Samrat Bhattacharjee, K. K. ...
ATAL
2009
Springer
16 years 1 months ago
A self-organizing neural network architecture for intentional planning agents
This paper presents a model of neural network embodiment of intentions and planning mechanisms for autonomous agents. The model bridges the dichotomy of symbolic and non-symbolic ...
Budhitama Subagdja, Ah-Hwee Tan