les to further raise the abstraction level of the initial specification, where dynamic data sets can be specified without low-level details. Our method is suited for hardware and s...
Chantal Ykman-Couvreur, J. Lambrecht, A. Van Der T...
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
In recent years the power of Grid computing has grown exponentially through the development of advanced middleware systems. While usage has increased, the penetration of Grid compu...
Gregor von Laszewski, Andrew J. Younge, Xi He, Kum...
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
Feihui Li, Chrysostomos Nicopoulos, Thomas D. Rich...