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TCAD
2008
114views more  TCAD 2008»
15 years 6 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
ICCAD
2003
IEEE
210views Hardware» more  ICCAD 2003»
16 years 3 months ago
Generalized Network Flow Techniques for Dynamic Voltage Scaling in Hard Real-Time Systems
Energy consumption is an important performance parameter for portable and wireless embedded systems. However, energy consumption must be carefully balanced with real-time responsi...
Vishnu Swaminathan, Krishnendu Chakrabarty
SIGCOMM
2010
ACM
15 years 6 months ago
NapSAC: design and implementation of a power-proportional web cluster
Energy consumption is a major and costly problem in data centers. A large fraction of this energy goes to powering idle machines that are not doing any useful work. We identify tw...
Andrew Krioukov, Prashanth Mohan, Sara Alspaugh, L...
ISCA
2009
IEEE
214views Hardware» more  ISCA 2009»
16 years 28 days ago
Phastlane: a rapid transit optical routing network
Tens and eventually hundreds of processing cores are projected to be integrated onto future microprocessors, making the global interconnect a key component to achieving scalable c...
Mark J. Cianchetti, Joseph C. Kerekes, David H. Al...
ISLPED
1997
ACM
104views Hardware» more  ISLPED 1997»
15 years 9 months ago
Composite sequence compaction for finite-state machines using block entropy and high-order Markov models
- The objective of this paper is to provide an effective technique for accurate modeling of the external input sequences that affect the behavior of Finite State Machines (FSMs). B...
Radu Marculescu, Diana Marculescu, Massoud Pedram