Advances in networking, sensors, medical devices and smart phones have made it feasible to monitor and provide medical and other assistance to people either in their homes or outs...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...
Heterogeneous supercomputers with combined general purpose and accelerated CPUs promise to be the future major architecture due to their wideranging generality and superior perfor...
In the near future, wireless sensor networks (WSN) performing sensing and communication tasks will be widely deployed as technology rapidly advances. Communication is one of the e...
—The performance bottleneck for many scientific applications is the cost of memory access inside linear algebra kernels. Tuning such kernels for memory efficiency is a complex ...