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HPCA
2009
IEEE
16 years 7 months ago
A novel architecture of the 3D stacked MRAM L2 cache for CMPs
Magnetic Random Access Memory (MRAM) is considered to be a promising future memory technology due to its low leakage power, high density and fast read speed. The heterogeneous int...
Guangyu Sun, Xiangyu Dong, Yuan Xie, Jian Li, Yira...
HPCA
2009
IEEE
16 years 7 months ago
Blueshift: Designing processors for timing speculation from the ground up
Several recent processor designs have proposed to enhance performance by increasing the clock frequency to the point where timing faults occur, and by adding error-correcting supp...
Brian Greskamp, Lu Wan, Ulya R. Karpuzcu, Jeffrey ...
HPCA
2009
IEEE
16 years 7 months ago
A low-radix and low-diameter 3D interconnection network design
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
MOBISYS
2009
ACM
16 years 7 months ago
EnTracked: energy-efficient robust position tracking for mobile devices
An important feature of a modern mobile device is that it can position itself. Not only for use on the device but also for remote applications that require tracking of the device....
Mikkel Baun Kjærgaard, Jakob Langdal, Torben...
ICCAD
2006
IEEE
115views Hardware» more  ICCAD 2006»
16 years 3 months ago
Thermal characterization and optimization in platform FPGAs
Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the probl...
Priya Sundararajan, Aman Gayasen, Narayanan Vijayk...