3006 search results - page 454 / 602 » Dimensionality reduction and generalization |
179
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
164
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
The bus tracing is used to catch related signals for further investigation and analysis. However, the trace size of cycleaccurate tracing is large and the trace cycle is shallow u...
184
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
The memory hierarchy of a system can consume up to 50% of microprocessor system power. Previous work has shown that tuning a configurable cache to a particular application can red...
159
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DAC
2004
ACM
16 years 7 months ago
2004
ACM
For multi-gigahertz synchronous designs in nanometer technologies, multiple clock cycles are needed to cross the global interconnects, thus making it necessary to have pipelined g...
162
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DAC
2005
ACM
16 years 7 months ago
2005
ACM
The race conditions often limit the smallest feasible clock period that the optimal clock skew scheduling can achieve. Therefore, the combination of clock skew scheduling and dela...