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180
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CODES
2007
IEEE
16 years 1 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
176
Voted
INFOCOM
2007
IEEE
16 years 29 days ago
RFID-Based 3-D Positioning Schemes
Abstract— This research focuses on RFID-based 3-D positioning schemes, aiming to locate an object in a 3-dimensional space, with reference to a predetermined arbitrary coordinate...
Chong Wang, Hongyi Wu, Nian-Feng Tzeng
IJCNN
2006
IEEE
16 years 21 days ago
Biologically Inspired KFLANN Place Fields for Robot Localization
– This paper presents a hippocampal inspired robot localization model that provides a means for a simple robotic platform with ultrasonic sensors to localize itself. There have b...
Alex Leng Phuan Tay
INFOCOM
2006
IEEE
16 years 21 days ago
Analyzing the Receiver Window Modification Scheme of TCP Queues
– Explicit Congestion Notification (ECN) and Active Queue Management (AQM) Schemes such as Random Early Detection (RED), Adaptive Random Early Detection (ARED) and BLUE queues ha...
Visvasuresh Victor Govindaswamy, Gergely V. Z&aacu...
IUI
2006
ACM
16 years 19 days ago
SWISH: semantic analysis of window titles and switching history
Information workers are often involved in multiple tasks and activities that they must perform in parallel or in rapid succession. In consequence, task management itself becomes y...
Nuria Oliver, Greg Smith, Chintan Thakkar, Arun C....
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