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EUROSYS
2006
ACM
16 years 3 months ago
Solving the starting problem: device drivers as self-describing artifacts
Run-time conflicts can affect even the most rigorously tested software systems. A reliance on execution-based testing makes it prohibitively costly to test every possible interac...
Michael F. Spear, Tom Roeder, Orion Hodson, Galen ...
ICCAD
2008
IEEE
170views Hardware» more  ICCAD 2008»
16 years 3 months ago
Obstacle-avoiding rectilinear Steiner tree construction
— In today’s VLSI designs, there can be many blockages in a routing region. The obstacle-avoiding rectilinear Steiner minimum tree (OARSMT) problem has become an important prob...
Liang Li, Evangeline F. Y. Young
ICCAD
2006
IEEE
119views Hardware» more  ICCAD 2006»
16 years 3 months ago
FastRoute: a step to integrate global routing into placement
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
Min Pan, Chris C. N. Chu
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICCAD
2001
IEEE
143views Hardware» more  ICCAD 2001»
16 years 3 months ago
Transient Power Management Through High Level Synthesis
The use of nanometer technologies is making it increasingly important to consider transient characteristics of a circuit’s power dissipation (e.g., peak power, and power gradien...
Vijay Raghunathan, Srivaths Ravi, Anand Raghunatha...
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