Run-time conflicts can affect even the most rigorously tested software systems. A reliance on execution-based testing makes it prohibitively costly to test every possible interac...
Michael F. Spear, Tom Roeder, Orion Hodson, Galen ...
— In today’s VLSI designs, there can be many blockages in a routing region. The obstacle-avoiding rectilinear Steiner minimum tree (OARSMT) problem has become an important prob...
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
The use of nanometer technologies is making it increasingly important to consider transient characteristics of a circuit’s power dissipation (e.g., peak power, and power gradien...