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248
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MJ
2011
15 years 1 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
188
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CODES
1999
IEEE
15 years 11 months ago
1999
IEEE
With the growth of System on a Chip (SoC), the functionality of analog components must also be considered in the design process. This paper describes some of the design implementa...
167
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CODES
1997
IEEE
15 years 11 months ago
1997
IEEE
The Pia hardware-software co-simulator provides substantial speedups over traditional co-simulation methods by permitting dynamic changes in the level of detail when simulating co...
149
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DAC
1996
ACM
15 years 11 months ago
1996
ACM
Abstract: Exploration at the earliest stages of the design process is an integral component of effective low-power design. Nevertheless, superficial high-level analyses with insuff...
168
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WSC
2007
15 years 9 months ago
2007
The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...