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ICCD
2005
IEEE
102views Hardware» more  ICCD 2005»
16 years 3 months ago
Monitoring Temperature in FPGA based SoCs
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
Sivakumar Velusamy, Wei Huang, John Lach, Mircea R...
ICCAD
2007
IEEE
123views Hardware» more  ICCAD 2007»
16 years 3 months ago
Mapping model with inter-array memory sharing for multidimensional signal processing
Abstract – The storage requirements in data-intensive signal processing systems (including applications in video and image processing, artificial vision, medical imaging, real-t...
Ilie I. Luican, Hongwei Zhu, Florin Balasa
ICCAD
2004
IEEE
138views Hardware» more  ICCAD 2004»
16 years 3 months ago
A thermal-driven floorplanning algorithm for 3D ICs
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
Jason Cong, Jie Wei, Yan Zhang
ICCAD
2004
IEEE
87views Hardware» more  ICCAD 2004»
16 years 3 months ago
Exploiting level sensitive latches in wire pipelining
Wire pipelining emerges as a new necessity for global wires due to increasing wire delay, shrinking clock period and growing chip size. Existing approaches on wire pipelining are ...
V. Seth, Min Zhao, Jiang Hu
ICCAD
2002
IEEE
73views Hardware» more  ICCAD 2002»
16 years 3 months ago
Shaping interconnect for uniform current density
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...