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DATE
2006
IEEE
122views Hardware» more  DATE 2006»
16 years 18 days ago
Power analysis of mobile 3D graphics
— The world of 3D graphics, until recently restricted to high-end workstations and game consoles, is rapidly expanding into the domain of mobile platforms such as cellular phones...
Bren Mochocki, Kanishka Lahiri, Srihari Cadambi
ISCA
2005
IEEE
134views Hardware» more  ISCA 2005»
16 years 4 days ago
A High Throughput String Matching Architecture for Intrusion Detection and Prevention
Network Intrusion Detection and Prevention Systems have emerged as one of the most effective ways of providing security to those connected to the network, and at the heart of alm...
Lin Tan, Timothy Sherwood
ASPLOS
2004
ACM
15 years 12 months ago
Heat-and-run: leveraging SMT and CMP to manage power density through the operating system
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
Mohamed A. Gomaa, Michael D. Powell, T. N. Vijayku...
ISCA
2003
IEEE
157views Hardware» more  ISCA 2003»
15 years 11 months ago
Pipeline Damping: A Microarchitectural Technique to Reduce Inductive Noise in Supply Voltage
Scaling of CMOS technology causes the power supply voltages to fall and supply currents to rise at the same time as operating speeds are increasing. Falling supply voltages cause ...
Michael D. Powell, T. N. Vijaykumar
ITC
2003
IEEE
168views Hardware» more  ITC 2003»
15 years 11 months ago
A Built-In Self-Repair Scheme for Semiconductor Memories with 2-D Redundancy
Embedded memories are among the most widely used cores in current system-on-chip (SOC) implementations. Memory cores usually occupy a significant portion of the chip area, and do...
Jin-Fu Li, Jen-Chieh Yeh, Rei-Fu Huang, Cheng-Wen ...