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TCAD
2008
98views more  TCAD 2008»
15 years 6 months ago
Early Analysis and Budgeting of Margins and Corners Using Two-Sided Analytical Yield Models
Manufacturing process variations lead to variability in circuit delay and, if not accounted for, can cause excessive timing yield loss. The familiar traditional approaches to timin...
Khaled R. Heloue, Farid N. Najm
TVLSI
2002
118views more  TVLSI 2002»
15 years 6 months ago
A microcoded elliptic curve processor using FPGA technology
The implementation of a microcoded elliptic curve processor using field-programmable gate array technology is described. This processor implements optimal normal basis field operat...
Philip Heng Wai Leong, Ivan K. H. Leung
TCAD
2008
110views more  TCAD 2008»
15 years 5 months ago
A Reactive and Cycle-True IP Emulator for MPSoC Exploration
The design of MultiProcessor Systems-on-Chip (MPSoC) emphasizes intellectual-property (IP)-based communication-centric approaches. Therefore, for the optimization of the MPSoC inte...
Shankar Mahadevan, Federico Angiolini, Jens Spars&...
EMSOFT
2010
Springer
15 years 4 months ago
PinaVM: a systemC front-end based on an executable intermediate representation
SystemC is the de facto standard for modeling embedded systems. It allows system design at various levels of abstractions, provides typical object-orientation features and incorpo...
Kevin Marquet, Matthieu Moy
CASES
2010
ACM
15 years 4 months ago
Hardware trust implications of 3-D integration
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...