4394 search results - page 519 / 879 » Designing agent chips |
157
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GLVLSI
2009
IEEE
16 years 1 months ago
2009
IEEE
This paper proposes a scheme for automatic re-distribution layer (RDL) routing, which is used in chip-package connections. Traditional RDL routing designs are mostly performed man...
150
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ISLPED
2009
ACM
16 years 1 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
142
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MICRO
2008
IEEE
16 years 1 months ago
2008
IEEE
Processors progressively age during their service life due to normal workload activity. Such aging results in gradually slower circuits. Anticipating this fact, designers add timi...
168
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
Content addressable memory (CAM) is widely used in many applications that require fast table lookup. Due to the parallel comparison feature and high frequency of lookup, however, ...
154
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
Networks-on-Chip (NoCs) have recently emerged as a scalable alternative to classical bus and point-to-point architectures. To date, performance evaluation of NoC designs is largel...