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179
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DATE
2004
IEEE
15 years 10 months ago
2004
IEEE
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...
178
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DSD
2006
IEEE
15 years 10 months ago
2006
IEEE
We present a flexible method for bus and network on chip performance analysis, which is based on the adaptation of workload models to resemble various applications. Our analysis m...
165
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CODES
2001
IEEE
15 years 10 months ago
2001
IEEE
The implementation of embedded networked appliances requires a mix of processor cores and HW accelerators on a single chip. When designing such complex and heterogeneous SoCs, the...
181
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ISLPED
1995
ACM
15 years 10 months ago
1995
ACM
Prompted by demands for portability and low-cost packaging, the electronics industry has begun to view power consumption as a critical design criteria. As such there is a growing ...
187
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ASPLOS
2010
ACM
15 years 10 months ago
2010
ACM
We present an all-optical approach to constructing data networks on chip that combines the following key features: (1) Wavelengthbased routing, where the route followed by a packe...