4394 search results - page 397 / 879 » Designing agent chips |
148
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MICRO
2009
IEEE
16 years 1 months ago
2009
IEEE
3D-integration is a promising technology to help combat the “Memory Wall” in future multi-core processors. Past work has considered using 3D-stacked DRAM as a large last-level...
146
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FC
2009
Springer
16 years 1 months ago
2009
Springer
Abstract. The Chip Authentication Programme (CAP) has been introduced by banks in Europe to deal with the soaring losses due to online banking fraud. A handheld reader is used toge...
182
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DATE
2008
IEEE
16 years 1 months ago
2008
IEEE
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thus, temperature gradients in Multiprocessor Systems on Chip (MPSoCs) can serious...
132
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DSN
2008
IEEE
16 years 1 months ago
2008
IEEE
Current technology trends of increased scale of integration are pushing CMOS technology into the deepsubmicron domain, enabling the creation of chips with a significantly greater...
180
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ICC
2007
IEEE
16 years 1 months ago
2007
IEEE
—The use of adaptively-routed wormhole switched k-ary n-cubes has been motivated by the high path diversity provided by the rich topology of this family of interconnection networ...