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ICCD
2006
IEEE
139views Hardware» more  ICCD 2006»
16 years 3 months ago
Perceptron Based Consumer Prediction in Shared-Memory Multiprocessors
Abstract— Recent research has shown that forwarding speculative data to other processors before it is requested can improve the performance of multiprocessor systems. The most re...
Sean Leventhal, Manoj Franklin
ICCD
2004
IEEE
98views Hardware» more  ICCD 2004»
16 years 3 months ago
Thermal-Aware IP Virtualization and Placement for Networks-on-Chip Architecture
Networks-on-Chip (NoC), a new SoC paradigm, has been proposed as a solution to mitigate complex on-chip interconnect problems. NoC architecture consists of a collection of IP core...
Wei-Lun Hung, Charles Addo-Quaye, Theo Theocharide...
ICCAD
2004
IEEE
138views Hardware» more  ICCAD 2004»
16 years 3 months ago
A thermal-driven floorplanning algorithm for 3D ICs
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
Jason Cong, Jie Wei, Yan Zhang
ICCAD
2003
IEEE
166views Hardware» more  ICCAD 2003»
16 years 3 months ago
Fault-Tolerant Techniques for Ambient Intelligent Distributed Systems
Ambient Intelligent Systems provide an unexplored hardware platform for executing distributed applications under strict energy constraints. These systems must respond quickly to c...
Diana Marculescu, Nicholas H. Zamora, Phillip Stan...
ICCAD
2002
IEEE
73views Hardware» more  ICCAD 2002»
16 years 3 months ago
Shaping interconnect for uniform current density
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...
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